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Wednesday, November 1, 2017

November 2017 Webinar Calendar

Webinar Calendar for engineers on the front-line of design and development View on Mobile Phone | View as Web page   Machine Design Webinar Calendar For engineers on the front-line of design and development     NOVEMBER 2017 LINE UP     11/2 - 2 pm ET Category: Power | Sponsored by: Mouser Electronics & Maxim Integrated   New SIMO Architecture Offers Smallest Form-Factor, Ultra-Low Standby Power and High System Efficiency for Hearables New consumer wearable, hearable, and connected devices are continually getting smaller and less invasive. However, these advancements mean increasing challenges for engineers. Gain a deeper understanding of SIMO technology and how it works and learn about Maxim’s PMICs, featuring the SIMO regulator, which reduce power dissipation and overall component count, while providing the same functionality of traditional solutions in less than half the space. >> Read More   Presenter: Cary Delano Distinguished MTS, Maxim Integrated   REGISTER   Presenter: Sami Nijim Senior MTS, Maxim Integrated   REGISTER     11/2 - 2 pm ET Category: Embedded | Sponsored by: Mouser Electronics & Intel   Why the Intel P4800X Optane SSD is the Most Responsive SSD in the World Learn more about why the Intel P4800X is the most responsive SSD in the world. We will discuss (1) how Intel Optane based products provide game-changing capabilities compared to NAND based SSDs, and (2) how Optane products can be configured to accelerate the performance of multiple datacenter solutions. >> Read More   Presenter: Joseph Nielsen Business Development Manager, Intel   REGISTER   Presenter: Zhdan Bybin Senior Applications Engineer, Intel   REGISTER     11/9 - 1 pm ET Category: Test & Measurement | Sponsored by: Keysight Technologies & Granite River Lab   USB Type-C Physical Layer Design USB Type-C™ has wasted no time in becoming the fastest adopted USB standard. Consumers love the reversible connector and the ability to deliver 100W of power, but these capabilities also significantly increase the complexity of the physical layer interconnections. Signal Integrity and Power Integrity Designers are scrambling to understand the cost/performance trade-offs and manufacturing design margins. This webcast will help you ensure that your next USB Type-C™ design can speed to market with verified compliance and design margin to spare. >> Read More   Presenter: Heidi Barnes Senior Application Engineer, Keysight Technologies   REGISTER   Presenter: Miki Takahashi Vice President of Engineering, Granite River Labs   REGISTER     11/9 - 2 pm ET Category: Materials | Sponsored by: PlastiComp   Make Better Products Using Versatile Long Fiber Reinforced Composites Long carbon and glass fiber reinforced thermoplastic composites are the go-to materials you need for structural components in applications that push the envelope of what plastics can do, even replacing metals. Find out how you can deploy long fiber’s stronger, stiffer, and tougher performance while also obtaining in-demand weight reduction and saving on costs by simplifying manufacturing. >> Read More   Presenter: Greg Clark   REGISTER   Presenter: Mark-Henry Wakim   REGISTER     11/15 - 11 am ET Category: Analog | Sponsored by: Analog Devices & Arrow   Explaining Phase Noise This webinar explores phase noise, as it relates to radio frequency applications, and mixed signal applications. Also discussed will be the different sources of phase noise, and how to achieve the lowest jitter using a Phase Locked Loop (PLL) circuit. >> Read More   Presenter: Ian Collins Applications Manager, Analog Devices   REGISTER     11/28 - 2 pm ET Category: Sensors | Sponsored by: TE Connectivity & DigiKey   Technical Evolution Drives Demand for Digital Temperature Sensing Digital temperature sensors are increasingly critical to a wide assortment of applications – from wearables to autonomous vehicles. But what is it that makes them well suited to so many applications and what trends are driving the evolution of digital temperature sensors? >> Read More   Presenter: Bill Howard Product Manager, TE Connectivity Temperature Products Line   REGISTER   Presenter: Devin Brock Manager for Product Knowledge and Training Sensor Solutions, TE Connectivity   REGISTER     11/29 - 2 pm ET Category: Materials | Sponsored by: COMSOL   Modeling the Assembly and Failure of Adhesive Joints For sophisticated applications of adhesives, simulation can be a powerful tool for improving assembly processes by predicting adhesive flow and cure as well as improving joint design by predicting mechanical failure modes. In this webinar, we will share two examples of using the COMSOL Multiphysics® software to simulate adhesive joints. We will focus our discussion on tracking the degree of adhesive cure during the bonding process, and on defining and calibrating the decohesion behavior of adhesive interfaces. >> Read More   Presenter: Mark Oliver Veryst Engineering   REGISTER   Presenter: Henrik Sönnerlind COMSOL   REGISTER     NOW AVAILABLE ON DEMAND     Category: 3D Printing | Sponsored by: ANSYS Never Let Faceted Data Slow You Down: SpaceClaim for 3D Printing   Category: 3D Printing | Sponsored by: HP Jet Fusion 3D Printing Costs and Business Implications Across Product Life Cycles   Category: 3D Printing | Sponsored by: Stratasys How Large-Scale 3D Printing is Being Deployed in Complex Electronics and Medical Devices (Part 1 of 3)   How Additive Manufacturing is Revolutionizing the Transportation and Industrial Machinery Industries (Part 2 of 3)   How Additive Manufacturing is Being Deployed to Solve SOme of the Largest Challenges in Process Industries (Part 3 of 3)     Category: Analog | Sponsored by:Analog Devices & Richardson RFPD Overcoming Challenges in GaN Power Amplifier Implementations     Category: Automotive | Sponsored by: Texas Instruments The Role of Sensor Fusion in Advanced Driver Assistance Systems     Category: Embedded | Sponsored by: Proto Labs Rapid Injection Molding: Design Essentials for Overmolding and Insert Molding     Category: Fastening & Joining | Sponsored by: 3M Structural Adhesives vs. Fasteners - What's the Right Choice for Your Application?     Category: IoT | Sponsored by:ON Semiconductor Designing for Ultra-low Power IoT Devices – Considerations and Challenges     Category: Motion Control/Automation | Sponsored by: igus® Reducing Downtime and Eliminating Cable Failure     Category: Power | Sponsored by: Inventus Power Annual Update on Li-ion Battery Technology     Category: Smart Meters | Sponsored by: Analog Devices Taking Control of Smart Meters with Diagnostic Data     Category: Test & Measurement | Sponsored by: Keysight Technologies Stop Wasting Time and Money by Struggling with Data Analytics While Designing T&M Experiments!   Microwave Device Characterization Using the Latest Vector Network Analyzers   Physical Layer Testing of USB Type-C Products   Six Reasons Your New Medical IoT Device Will Fail   NextGen Test Strategies for Wideband Measurements   Category: Test & Measurement | Sponsored by: Keysight Technologies & Electro Rent Increase RF and Microwave Test Efficiency and Throughput   Category: Test & Measurement | Sponsored by: Keysight Technologies &TestEquity Debug and Test Automotive CAN FD Buses for Higher Reliability       READING FROM MACHINE DESIGN LIBRARY       The Future of Collaborative Robots This 14-page E-Book is your guide to Industrial Robots and their impact on the Modern Workforce. Industrial Robots focuses on information that all ME’s need to know. >> Read More             Want more information? Sign up for our newsletters for more expert content right at your fingertips:       Sign Up for Electronic Design newsletters     Sign Up for Power Electronics newsletters     Sign Up for Machine Design newsletters       Sign Up for Microwaves & RF newsletters     Sign Up for Hydraulics & Pneumatics newsletters             If you do not wish to receive the webinar calendar, in the future, click here.Electronic Design | Penton | 1166 Avenue of the Americas, 10th Floor | New York, NY 10036 | USA | Privacy Statement  

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